SEMICON Korea 2026

We would like to express our gratitude to Dr. Joonho You, CEO of nexensor for his remarkable presentation at SEMICON Korea on high-throughput metrology for Chemical Mechanical Planarization (CMP). CMP is a key technology enabling the hybrid bonding for 3D integration, acting as the groundwork for yield, electrical performance and device reliability by ensuring atomic-level flatness across complex multilayer structures. It prevents critical failures like stacking defects, inter-layer voids, and signal degradation by managing precise material removal in 3D NAND and TSV processes. Without advanced CMP metrology, 3D stacked devices would suffer from high defect rates and poor electrical performance due to improper stacking and insufficient surface planarization. Achieving wafer-level planarity at the nanometer scale is essential as device dimensions and layer thickness continue to shrink.

The presented ultra-fast correlative metrology approach integrates optical interferometry, AFM and deflectometry to quantify Cu dishing and provide rapid feedback for CMP process control with speeds of square millimeter per second.

The fast AFM from nano analytik GmbH is based on next generation self-actuating and self-sensing called active cantilevers, delivering reference Angstrom range data with scanning speed in millimeter range per second with unique measurement repeatability. The video below shows the system performing a high speed scan on a 20 µm TSV-Cu structure.

Visit https://www.linkedin.com/posts/nano-analytik-gmbh_high-speed-afm-imaging-activity-7432760303211184129-2FxX?utm_source=share&utm_medium=member_desktop&rcm=ACoAACBra3MBFEl-TOFt22T6sYwZwJeltpAFi64 to see the result of high speed imaging using nano analytik fast AFM.