The EU-EUREKA project is developing an ultra-fast, high-precision platform for metrology and defect analysis in 3D chip manufacturing by combining optical interferometric measurements with Atomic Force Microscopy (AFM).
The project focuses on advancing metrology technologies for the development and in-line monitoring of next-generation semiconductor manufacturing, with a particular emphasis on heterogeneous integration. The goal is to develop a high-speed 3D metrology system for 300 mm wafers, achieving a throughput of 50 to 60 wafers per hour with a resolution of 300 pm. To meet these performance targets, all supporting components of this novel system, including interferometry, active cantilevers, scanners, sensors, hardware, and software- are being systematically advanced through close collaboration among the project partners. The consortium brings together partners from Austria, Poland, Bulgaria, South Korea, and Germany.